Microelectronic Packaging - A Bibliography
von A. H. Agajanian
2012 Kartoniert, 256 Seiten, 254mm x 178mm x 15mm, Sprache(n): eng Microelectronic packaging protects and supports electronic devices and circuits and provides connections to the other parts of the system. The protection function avoids mechanical, electrical, chemical, contamination, and photo-…
Microelectronic Devices - Second Edition
von Keith Leaver
1997 Kartoniert, 250 Seiten, 229mm x 152mm x 14mm, Sprache(n): eng The second edition of this introductory book sets out clearly and concisely the principles of operation of the semiconductor devices that lie at the heart of the microelectronic revolution. The book aims to teach the reader how s…
Microelectronic Systems - Circuits, Systems and Applications
von Albert Heuberger Verlag: Springer Berlin,
2011 2011. Neubindung, Buchschnitt leicht verkürzt, Buchecken und -kanten leicht angestoßen, Ausgabe 2011 11556666/12
Microelectronic Devices - Second Edition
von Keith Leaver
1997 Gebunden, 250 Seiten, 235mm x 157mm x 18mm, Sprache(n): eng The second edition of this introductory book sets out clearly and concisely the principles of operation of the semiconductor devices that lie at the heart of the microelectronic revolution. The book aims to teach the reader how sem…
Microelectronic Systems - Circuits, Systems and Applications
2014 Kartoniert, 388 Seiten, 235mm x 155mm x 21mm, Sprache(n): eng Dedicated to Prof. Dr. Heinz Gerhäuser on the occasion of his retirementThis book is dedicated to Prof. Dr. Heinz Gerhäuser on the occasion of his retirement both from the position of Executive Director of the Fraunhofer Institut…
Microelectronic Systems - Circuits, Systems and Applications
2011 Gebunden, 388 Seiten, 241mm x 160mm x 26mm, Sprache(n): eng Dedicated to Prof. Dr. Heinz Gerhäuser on the occasion of his retirementThis book is dedicated to Prof. Dr. Heinz Gerhäuser on the occasion of his retirement both from the position of Executive Director of the Fraunhofer Institute…
Microelectronic Circuits
von K. C. A. Smith Adel S. Sedra Verlag: Oxford University Press Inc,
4 1997. Gebundene Ausgabe, Maße: 24.28 cm x 5.31 cm x 20.17 cm 1156 S. Gebrauchs- und Lagerspuren. AuÃ?en: verschmutzt, angestoÃ?en. Aus der Auflösung einer renommierten Bibliothek. Kann Stempel beinhalten. Fehlt: CD. 1515414/203
Robust Microelectronic Devices
2022 Gebunden, 130 Seiten, 250mm x 175mm x 13mm, Sprache(n): eng Integrated electronic circuits have influenced our society over the past decades and have become an indispensable part of our daily lives. To maintain this development and ensure benefits for decades to come, continuous further dev…
3D Microelectronic Packaging - From Fundamentals to Applications
2018 Kartoniert, 476 Seiten, 235mm x 155mm x 26mm, Sprache(n): eng Provides comprehensive coverage of the state-of-the-art in 3D microelectronic packages Covers advanced materials and processes, quality and reliability concerns, and fault isolation and failure analysis Discusses 3D electronic…
3D Microelectronic Packaging - From Architectures to Applications
2021 Kartoniert, 640 Seiten, 235mm x 155mm x 35mm, Sprache(n): eng Provides comprehensive coverage of 3D microelectronic packagesExplains the fundamentals of using solder interconnects as micro-bumpsDemonstrates the advanced materials and processes used in 3D microelectronic packagesIntroduces r…
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