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Buchfreund als App
Jiashi Yang received his B.E. and M.E. in Engineering Mechanics in 1982 and 1985 from Tsinghua University, China, M.S. in Mechanical Engineering in 1988 from Syracuse University, USA, and his Ph.D. in Civil Engineering in 1993 from Princeton University, USA. He was a Postdoctoral Fellow from 1993 through 1994 at the University of Missouri-Rolla and from 1994 through 1995 at Rensselaer Polytechnic Institute. He was employed by Motorola, Inc. from 1995 through 1997. Since 1997 he has been an Assistant, Associate, and Full Professor at the Department of Mechanical and Materials Engineering of the University of Nebraska-Lincoln. His main research area is theoretical and numerical modeling of piezoelectric structures and devices.