Silicon, from Sand to Chips, Volume 2 - Microelectronic Chips, Solar Cells, Mems
von Alain Vignes
Vorbestellbar - erscheint am 11.07.2024 Gebunden, 186 Seiten, Sprache(n): eng
219,33 EUR
Silicon, from Sand to Chips, Volume 1 - Microelectronic Components
von Alain Vignes
Vorbestellbar - erscheint am 11.07.2024 Gebunden, 250 Seiten, Sprache(n): eng
219,33 EUR
Shipped Ships (2 Vols)
0. paperback Seiten; 9783935293211.2
109,61 EUR
Dictionary of American Naval Fighting Ships, Volume 1 - 8 (kompl. )
Verlag: Office of the Chief of Naval Operations, Washingt…
1977. Gr.-8°, Hardcover Gut erhaltene acht Bände
Corporeal Archipelagos - Writing the Body in Francophone Oceanian Women's Literature
von Julia Frengs
2017 Gebunden, 224 Seiten, 235mm x 157mm x 18mm, Sprache(n): eng Corporeal Archipelagos: Writing the Body in Francophone Oceanian Women's Literature offers an examination of contemporary literature from the French-speaking Oceanian region through a focus on four of its most prolific women writer…
173,47 EUR
DAVID CHIPPERFIELD
Gebundene Ausgabe Gepflegter, sauberer Zustand. 42701563/2
- Sonderaktion: 10% Rabatt bis 04.07.2024
137,99 EUR
124,19 EUR
David Chipperfield Architects
von Rik Nys Verlag: König, Walther
2013. paperback 384 Seiten; 9783863351342.3
247,34 EUR
Cruisicology - The Music Culture of Cruise Ships
von David Cashman, Philip Hayward
2020 Gebunden, 126 Seiten, 235mm x 157mm x 12mm, Sprache(n): eng Since the 1990s the cruise industry has become one of the largest employers of musicians in the world. Thousands of professional musicians work on cruise ships daily, entertaining millions of passengers. Cruisicology: The Music Cul…
156,00 EUR
Simulation and Reliability Assessment of Advanced Packaging
2024 Gebunden, 296 Seiten, 250mm x 175mm x 24mm, Sprache(n): eng Topics covered in this reprint include material characterization, theoretical and empirical methods, modeling, simulation technology, design and validation, and AI-assisted design-on-simulation technology for electronic packaging.…
152,13 EUR
Chiplet Design and Heterogeneous Integration Packaging
von John H. Lau
2024 Kartoniert, 548 Seiten, 235mm x 155mm x 28mm, Sprache(n): eng The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on e…
143,80 EUR
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